Methods of manufacturing semiconductor devices

ABSTRACT

A plurality of nanowires is grown on a first substrate in a first direction perpendicular to the first substrate. An insulation layer covering the nanowires is formed on the first substrate to define a nanowire block including the nanowires and the insulation layer. The nanowire block is moved so that each of the nanowires is arranged in a second direction parallel to the first substrate. The insulation layer is partially removed to partially expose the nanowires. A gate line covering the exposed nanowires is formed. Impurities are implanted into portions of the nanowires adjacent to the gate line.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 USC § 119 to Korean PatentApplication No. 2007-122148, filed on Nov. 28, 2007, in the KoreanIntellectual Property Office (KIPO), the contents of which are hereinincorporated by reference in their entirety.

FIELD OF THE INVENTION

Exemplary embodiments relate to methods of manufacturing semiconductordevices. More particularly, exemplary embodiments relate to methods ofmanufacturing semiconductor devices having nanowire channels.

BACKGROUND

For the purpose of realizing a high integration degree, semiconductordevices having nanowire channels have been developed. Methods of formingnanowires may be divided into a top-down method and a bottom-up method,and each method has its own advantages and disadvantages. For example,in the top-down method, forming a nanowire at a desired position can beeasy, however, forming a nanowire smaller than a certain size may not beeasy, so a high integration degree may not be realized. In order toovercome such disadvantages, a double-patterning method has beendeveloped, however, performing the method can be complicated. A flowdirected alignment method, a Langmuir Blodgett (LB) method, and abubble-blown method are examples of the bottom-up method. In thesemethods, forming nanowires at desired positions in a desired arrangementmay not be easy, even though forming nanowires having minute sizes canbe easy.

SUMMARY

Exemplary embodiments provide a method of manufacturing a semiconductordevice including a nanowire channel that is minute in size andwell-arranged.

According to some exemplary embodiments, there is provided a method ofmanufacturing a semiconductor device. In the method, a plurality ofnanowires is grown on a first substrate in a first directionperpendicular to the first substrate. An insulation layer covering thenanowires is formed on the first substrate to define a nanowire blockincluding the nanowires and the insulation layer. The nanowire block ismoved so that each of the nanowires is arranged in a second directionparallel to the first substrate. The insulation layer is partiallyremoved to partially expose the nanowires. A gate line covering theexposed nanowires is formed. Impurities are implanted into portions ofthe nanowires adjacent to the gate line.

In exemplary embodiments, when the nanowires are grown, a nanowirecolumn having a plurality of nanowires arranged at a first distancetherebetween in a third direction perpendicular to the first directionmay be formed.

In exemplary embodiments, when the nanowire column is formed, a nanowirearray having a plurality of nanowire columns arranged at a seconddistance therebetween in a fourth direction perpendicular to the thirddirection may be formed. In exemplary embodiments, when the nanowiresare grown, the nanowires may be grown to a length less than the seconddistance.

In exemplary embodiments, when the nanowire block is defined, a portionof the insulation layer having a first width in the third direction maybe removed to form a plurality of nanowire blocks, each of whichincludes one nanowire column and an insulation layer pattern.

In exemplary embodiments, when the portion of the insulation layer isremoved, the portion of the insulation layer may be removed so that asurface of each nanowire may be exposed.

In exemplary embodiments, after the nanowires are grown, a tunnelinsulation layer, a charge storing layer and a blocking layer enclosingthe nanowires may be sequentially formed.

In exemplary embodiments, after the nanowire block is defined, both endportions of each nanowire may be removed.

In exemplary embodiments, when the insulation layer is partiallyremoved, an opening having a second width in a fifth directionperpendicular to the second direction may be formed.

In exemplary embodiments, a trench may be formed on the first substrateto be in fluid communication with the opening.

In exemplary embodiment, when the nanowire block is moved, the nanowireblock may be moved onto a second substrate, so that each of thenanowires may extend in a sixth direction parallel to the secondsubstrate.

In exemplary embodiments, a common source line (CSL), a bit line plugand a bit line may be further formed. The CSL and the bit line plug maymake contact with the nanowires, and the bit line may make contact withthe bit line plug. Each nanowire, a plurality of gate linescorresponding to each nanowire, the CSL, the bit line plug and the bitline may define a string. Each nanowire may have a length correspondingto integer times of a length of the string.

According to other exemplary embodiments, there is provided a method ofmanufacturing a semiconductor device. In the method, a plurality offirst nanowires is grown on a first substrate in a first directionperpendicular to the first substrate. A first insulation layer coveringthe first nanowires is formed to define a nanowire block including thefirst nanowires and the first insulation layer. The first nanowire blockis moved so that each of the nanowires is arranged in a second directionparallel to the first substrate. A second nanowire block includingsecond nanowires, each of which extends in a third direction parallel tothe first substrate, and a second insulation layer is disposed on thefirst nanowire block. The first and second insulation layers are removedusing the second nanowires as an etching mask. A gate line coveringportions of the first nanowires exposed by the second nanowires isformed. Impurities are implanted into portions of the first nanowiresadjacent to the gate line.

In exemplary embodiments, when the first and second insulation layersare removed, a dry etching process using the second nanowires as theetching mask may be performed. In exemplary embodiments, beforeimpurities are implanted into the portions of the first nanowires, thesecond nanowires may be removed.

In exemplary embodiments, when the first nanowire block is moved, thefirst nanowire block may be moved onto a second substrate, so that eachof the first nanowires may extend in a fourth direction parallel to thesecond substrate.

According to still other exemplary embodiments, there is provided amethod of manufacturing a semiconductor device. In the method, aplurality of nanowires is grown on a first substrate. A second substrateis moved above the first substrate to attach the nanowires on the firstsubstrate onto a face of the second substrate, so that each of thenanowires is arranged in a first direction parallel to the secondsubstrate. A first insulation layer covering the nanowires is formed todefine a nanowire block including the nanowires and the first insulationlayer. The first insulation layer is partially removed to partiallyexpose the nanowires. A gate line covering the exposed nanowires isformed. Impurities are implanted into portions of the nanowires adjacentto the gate line.

In exemplary embodiments, a material having a viscosity may be coated onthe second substrate so that the nanowires may be attached to the faceof the second substrate.

In exemplary embodiments, a second insulation layer having an opening,which defines an area for forming the nanowire block, may be formed onthe face of the second substrate.

In exemplary embodiments, after the nanowire block is formed, the secondinsulation layer may be removed.

In exemplary embodiments, when the nanowires are grown on the firstsubstrate, a plurality of catalyst particles may be coated on the firstsubstrate in a second direction perpendicular to the first direction,and the nanowires may be grown by a chemical vapor deposition (CVD)process.

In exemplary embodiment, the nanowires attached to the second substratemay be disposed at a given distance therebetween in a second directionperpendicular to the first direction to form a nanowire column.

In exemplary embodiments, a plurality of nanowire columns may bedisposed at a given distance therebetween in the first direction to forma nanowire array.

In exemplary embodiments, when the nanowire block is defined, a portionof the first insulation layer having a given width in the seconddirection may be removed to form a plurality of nanowire blocks, each ofwhich includes one nanowire column and an insulation layer pattern.

In exemplary embodiments, after the nanowire block is defined, both endportions of each nanowire may be removed.

According to some exemplary embodiments, a semiconductor deviceincluding a nanowire channel having a minute size may be easilymanufactured. For example, a nanowire channel having a minute size andbeing well-arranged may be formed by a hybrid method including atop-down method and a bottom-up method, so that a highly integratedsemiconductor device may be manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings. FIGS. 1 to 36 represent non-limiting, exemplary embodiments asdescribed herein.

FIGS. 1 to 3, FIGS. 5 to 11, and FIG. 16 are perspective viewsillustrating a method of manufacturing a semiconductor device inaccordance with some exemplary embodiments;

FIG. 4 is an enlarged perspective view of an area A in FIG. 3;

FIGS. 12 and 13 are cross-sectional views taken along lines I-I′ andII-II′, respectively, in FIG. 11;

FIGS. 14 and 15 are cross-sectional views illustrating gate lines inaccordance with an exemplary embodiment, and particularly FIGS. 14 and15 are cross-sectional views taken along lines I-I′ and II-II′,respectively, in FIG. 11;

FIGS. 17 and 18 are cross-sectional views illustrating a method ofmanufacturing a flash memory device in accordance with some exemplaryembodiments, and particularly FIGS. 17 and 18 are cross-sectional viewstaken along line III-III′ in FIG. 16;

FIGS. 19 to 22 are perspective views illustrating a method ofmanufacturing a semiconductor device in accordance with some exemplaryembodiments;

FIG. 23 is a cross-sectional view illustrating a method of manufacturinga flash memory device in accordance with some exemplary embodiments;

FIGS. 24, 25, and 27 to 30 are perspective views illustrating a methodof manufacturing a semiconductor device in accordance with someexemplary embodiments;

FIG. 26 is an enlarged perspective view of an area B in FIG. 25; and

FIGS. 31 to 36 are perspective views illustrating a method ofmanufacturing a semiconductor device in accordance with some exemplaryembodiments.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Various exemplary embodiments will be described more fully hereinafterwith reference to the accompanying drawings, in which some exemplaryembodiments are shown. The present invention may, however, be embodiedin many different forms and should not be construed as limited to theexemplary embodiments set forth herein. Rather, these exemplaryembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the present invention tothose skilled in the art. In the drawings, the sizes and relative sizesof layers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layer,or intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numerals refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms “first”, “second”,“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, a first element, component, region, layer or sectiondiscussed below could be termed a second element, component, region,layer or section without departing from the teachings of the presentinvention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(e.g., rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularexemplary embodiments only and is not intended to be limiting of thepresent invention. As used herein, the singular forms “a,” “an” and“the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. It will be further understood thatthe terms “comprises” and “comprising,” when used in this specification,specify the presence of stated features, integers, steps, operations,elements, and/or components, but do not preclude the presence oraddition of one or more other features, integers, steps, operations,elements, components, and/or groups thereof.

Exemplary embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized exemplary embodiments (and intermediate structures). As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments should not be construed as limitedto the particular shapes of regions illustrated herein but are toinclude deviations in shapes that result, for example, frommanufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the figures are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to limit the scope ofthe present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Hereinafter, exemplary embodiments will be explained in detail withreference to the accompanying drawings.

FIGS. 1 to 3, FIGS. 5 to 11, and FIG. 16 are perspective viewsillustrating a method of manufacturing a semiconductor device inaccordance with some exemplary embodiments.

Referring to FIG. 1, a plurality of catalyst particles 112 is appliedonto a first substrate 100.

The first substrate 100 may include an insulating material. For example,the first substrate 100 may include an oxide such as silicon oxide, anitride such as silicon nitride, etc. Each of the catalyst particles 112has a diameter of about several nanometers, and may include a metal. Forexample, the catalyst particles 112 may include gold, nickel, cobalt,aluminum, etc.

The catalyst particles 112 may be applied onto the first substrate 100by an imprint method, a lift-off method or a photo-etch method.

The catalyst particles 112 are applied onto the first substrate 100 at afirst distance D1 therebetween in a third direction parallel to thefirst substrate 100, and may form a catalyst particle column. The firstdistance D1 may correspond to a distance between strings, which will beformed later. In some exemplary embodiments, a plurality of the catalystparticle columns is formed at a second distance D2 therebetween in asecond direction perpendicular to the third direction, and may form acatalyst particle array.

Referring to FIG. 2, a chemical vapor deposition (CVD) process using ananowire source gas is performed to grow a plurality of nanowires 114 atpositions where the catalyst particles 112 are formed. The catalystparticles 112 may remain on the nanowires 114. The nanowires 114 maygrow to a first length L1 in a first direction perpendicular to thefirst substrate 100. If a process for removing end portions of ananowire block, which will be described later, is not performed, thefirst length L1 may have a value corresponding to integer times of alength of the string. In some exemplary embodiments, the first length L1is less than the second distance D2. As the nanowires 114 grow, ananowire column and a nanowire array, which correspond to the catalystparticle column and the catalyst particle array, respectively, may beformed on the first substrate 100.

A silicon source gas, such as silane (SiH₄), tetrachlorosilane (SiCl₄),etc. or a germanium source gas, such as germane (GeH₄), germaniumtetrachloride (GeCl₄), etc., may be used as the nanowire source gas.Accordingly, nanowires 114 may grow to be semiconductor nanowiresincluding silicon or germanium. In some exemplary embodiments, when thenanowires 114 are grown, a p-type impurity source gas (such as diborane(B₂H₆)) or an n-type source gas (such as phosphine (PH₃)) may be furtherused, so that a semiconductor nanowire doped with p-type impurities orn-type impurities may be formed.

FIG. 4 is an enlarged perspective view of an area A in FIG. 3.

Referring to FIGS. 3 and 4, a tunnel insulation layer 120, a chargestoring layer 125 and a blocking layer 130 are sequentially formed oneach of the nanowires 114 and each of the catalyst particles 112. Thus,a plurality of nanowire structures 116, each of which includes thenanowire 114, the catalyst particle 112, the tunnel insulation layer120, the charge storing layer 125 and the blocking layer 130, is formedon the first substrate 100. The tunnel insulation layer 120, the chargestoring layer 125 and the blocking layer 130 may be formed by a CVDprocess or an atomic layer deposition (ALD) process.

In FIG. 3, the tunnel insulation layer 120, the charge storing layer 125and the blocking layer 130 are not shown in order to avoid complicatingthe drawings, and in the same manner, other drawings do not show theabove layers, except for FIGS. 17, 18 and 23.

The tunnel insulation layer 120 is formed to insulate each of thenanowires 114 from the charge storing layer 125. The tunnel insulationlayer 120 may be formed using silicon oxide, silicon nitride or a metaloxide having a high dielectric constant. For example, the tunnelinsulation layer 120 may be formed using silicon oxide, silicon nitride,hafnium oxide, zirconium oxide, aluminum oxide, hafnium silicon oxide,zirconium silicon oxide, hafnium aluminum oxide, lanthanum aluminumoxide, etc.

The charge storing layer 125 may store charges that have moved from achannel region in each of the nanowires 114. The charge storing layer125 may be formed using a nitride such as silicon nitride, a hafniumoxide such as hafnium silicon oxide, polysilicon, etc.

The blocking layer 130 may insulate gate lines 150 (see FIG. 11), whichwill be formed later, from the charge storing layer 125. The blockinglayer 130 may be formed using a metal oxide or a silicon oxide.Alternatively, the blocking layer 130 may be formed to have amulti-layered structure in which a silicon oxide layer, a siliconnitride layer, and a silicon oxide layer are sequentially stacked.

Referring to FIG. 5, an insulation layer 135 is formed on the firstsubstrate 100 to cover the nanowire structures 116. Thus, a nanowireblock having the nanowire structures 116 and the insulation layer 135 isformed. In some exemplary embodiments, the insulation layer 135 isformed to cover one nanowire structure column including a plurality ofnanowire structures 116 formed in the third direction. In otherexemplary embodiments, the insulation layer 135 is formed to cover ananowire structure array including a plurality of nanowire structurecolumns formed in the second direction. Hereinafter, only the case inwhich the insulation layer 135 covers the nanowire structure array willbe described for convenience.

The insulation layer 135 may be formed by depositing an insulatingmaterial having an etching selectivity with respect to silicon oxide,and planarizing the deposited insulating material. For example, theinsulation layer 135 may be formed using an insulating material such assilicon carbide (SiC_(x)) or an organo-silicon material. The insulationlayer 135 may have a height substantially the same as the first lengthL1 corresponding to the length of the nanowire structure 116.

Referring to FIG. 6, the insulation layer 135 is partially removed toform a plurality of insulation layer patterns 137 distant from eachother at a first width W1. Thus, a plurality of nanowire blocks each ofwhich includes one insulation layer pattern 137 and one nanowirestructure column may be formed. In particular, portions of theinsulation layer 135, each of which extends in the third direction andhas the first width W1 in the second direction may be removed by aphotolithography process, so that a plurality of insulation layerpatterns 137 may be formed. In exemplary embodiments, the insulationlayer patterns 137 may be formed by performing a directional dry etchingprocess until one surface of each nanowire structure 116 is exposed.Each nanowire block may include the nanowire structures 116 belonging tothe nanowire structure column, and the insulation layer pattern 137exposing one surface of each nanowire structure 116 and covering theother surface of each nanowire structure 116. Alternatively, each of theinsulation layer patterns 137 may be formed to completely cover thesurfaces of the nanowire structures 116.

Referring to FIG. 7, the nanowire blocks are moved so that the nanowirestructures 116 are arranged in a direction parallel to the firstsubstrate 100. In exemplary embodiments, each nanowire block is rotated90 degrees so that each of the nanowire structures 116 may be arrangedin the second direction. The exposed surfaces of the nanowire structures116 may contact the first substrate 100. The first width W1 is largerthan the first length L1, and thus the orientation may be performedeasily. Hereinafter, the case in which each of the nanowire structures116 is arranged in the second direction will be described.

As shown in FIG. 8, the nanowire blocks may be moved onto a secondsubstrate 200 different from the first substrate 100. That is, thenanowire blocks may be moved onto the second substrate 200, so that eachof the nanowire structures 116 may be arranged in a direction parallelto the second substrate 200. In this case, the nanowire blocks are movedonto the second substrate 200 on which the nanowires 114 are notoriginally grown. Thus, after growing the nanowires 114 on one substratewhere the nanowires 114 may be easily grown, a process for manufacturinga semiconductor device may be performed on another substrate where thesemiconductor device may be easily manufactured.

Referring to FIG. 9, both end portions of each nanowire block areremoved. In particularly, both end portions of each nanowire block inthe second direction are removed, so that the catalyst particles 112 ofthe nanowire structures 116 may be removed. That is, the catalystparticles 112 lowering the uniformity of the electrical characteristicsof the nanowires 114 are removed, and lengths of the nanowires 114 thatare overgrown are controlled. Thus, each of the nanowire blocks may havea second length L2 in the second direction. The second length L2 may beinteger times of the string length. Alternatively, only one end portionof each nanowire block adjacent to each catalyst particle 112 may beremoved. Alternatively, the process for removing the end portions of thenanowire blocks may not be performed. In this case, the first length L1may have a value corresponding to integer times of the string length.Even though the process for removing the end portions of the nanowireblocks is performed, the sizes of the catalyst particles 112 are muchsmaller than the lengths of the nanowires 114, and thus the first lengthL1 is very similar to the second length L2.

Hereinafter, only one nanowire block will be described for convenience.

Referring to FIG. 10, the insulation layer pattern 137 is partiallyremoved by a photolithography process using a photoresist pattern (notshown) to form an opening 145 partially exposing the nanowire structures116. In exemplary embodiments, a plurality of openings 145, each ofwhich extends in the third direction and has a second width W2 in thesecond direction, is formed. The insulation layer pattern 137 has anetching selectivity with respect to the blocking layer 130, which isformed at a peripheral portion of each nanowire structure 116, so thatthe blocking layer 130 may not be damaged during the photolithographyprocess. Additionally, portions of the insulation layer pattern 137under the nanowire structures 116 may be easily removed even though eachnanowire structure 116 has a cylindrical shape.

Referring to FIG. 11, a conductive layer filling up the opening 145 isformed on the first substrate 100. The conductive layer may be formedusing polysilicon, a metal or a metal silicide. An upper portion of theconductive layer is planarized to form a gate line 150. In exemplaryembodiments, a plurality of gate lines 150, each of which extends in thethird direction and fills up the openings 145, is formed. The insulationlayer pattern 137 is removed.

FIGS. 12 and 13 are cross-sectional views taken along lines I-I′ andII-II′, respectively, in FIG. 11.

Referring to FIGS. 12 and 13, the nanowire structures 116, each of whichextends in the second direction, are formed on the first substrate 100,and the gate lines 150, each of which extends in the third direction andencloses a portion of the nanowire structures 116 in an Ω-shape, areformed on the first substrate 100.

FIGS. 14 and 15 are cross-sectional views illustrating gate lines 160 inaccordance with other exemplary embodiments. FIGS. 14 and 15 arecross-sectional views taken along lines I-I′ and II-II′, respectively,in FIG. 11.

Referring to FIGS. 14 and 15, a plurality of trenches 105, each of whichextends in the third direction, is formed on a third substrate 102 inthe second direction. The trenches 105 are filled with the gate lines160, and the nanowire structures 116 are enclosed by the gate lines 160.Thus, a gate-all-around (GAA) type semiconductor device may bemanufactured.

The GAA type semiconductor device shown in FIGS. 14 and 15 may be formedby following methods.

The nanowire block is positioned on the third substrate 102 having thetrenches 105, each of which extends in the third direction and has thesecond width W2 in the second direction. Each nanowire structure 116included in the nanowire block is arranged in the second direction. Theinsulation layer 135 is partially removed to form the insulation layerpattern 137 having the openings 145, each of which extends in the thirddirection and has the second width W2 in the second direction. Each ofthe openings 145 may be formed to be in fluid communication with each ofthe trenches 105. A conductive layer that fills the openings 145 and thetrenches 105 is formed on the third substrate 102 and planarized to formthe gate lines 160 enclosing portions of the nanowire structures 116.The insulation layer pattern 137 is removed.

Referring to FIG. 16, impurities are implanted into the nanowirestructures 116 exposed by the gate lines 150. Thus, an impurity region114 b (see FIG. 17) doped with the impurities and a channel region 114 a(see FIG. 17) covered by the gate lines 150 may be formed in each of thenanowires 114.

When the nanowires 114 include silicon or germanium doped with p-typeimpurities, the implantation process may be performed using a Group IIIelement such as boron, and when the nanowires 114 includes silicon orgermanium doped with n-type impurities, the implantation process may beperformed using a Group V element such as phosphorus.

Therefore, a semiconductor device having a Ω-type gate line or a GAAtype semiconductor device may be manufactured.

A flash memory device including a nanowire channel may be manufacturedby the following processes. For convenience, the processes are describedwith reference to FIGS. 17 and 18, which are cross-sectional views takenalong the line III-III′ in FIG. 16.

Referring to FIG. 17, a first insulating interlayer 170 is formed on thefirst substrate 100 to cover the gate lines 150 and the nanowirestructures 116. The first insulating interlayer 170 may be formed usingan oxide such as silicon oxide by a CVD process or an ALD process.

The gate lines 150 include a plurality of word lines 152, a stringselection line (SSL) 154 and a ground selection line (GSL) 156. Inexemplary embodiments, 32 word lines 152 are formed between the SSL 154and the GSL 156.

Additionally, the nanowire 114 in the nanowire structure 116 includesthe channel region 114 a and the impurity region 114 b.

The first insulating interlayer 170, the blocking layer 130, the chargestoring layer 125 and the tunnel insulation layer 120 are partiallyremoved to form a first hole extending in the third direction, and afirst conductive layer is formed to fill the first hole. The firstconductive layer may be formed using polysilicon, a metal or a metalsilicide. An upper portion of the first conductive layer is planarizedto form a common source line (CSL) 175 that contacts the impurity region114 b of the nanowire 114.

A second insulating interlayer 180 is formed on the first insulatinginterlayer 170 and the CSL 175. The second insulating interlayer 180 maybe formed using an oxide such as silicon oxide by a CVD process or anALD process.

The second insulating interlayer 180, the first insulating interlayer170, the blocking layer 130, the charge storing layer 125 and the tunnelinsulation layer 120 are partially removed to form a second hole, and asecond conductive layer is formed to fill the second hole. The secondconductive layer may be formed using polysilicon, a metal or a metalsilicide. An upper portion of the second conductive layer is planarizedto form a bit line plug 185 that contacts the impurity region 114 b ofthe nanowire 114.

A third conductive layer is formed on the second insulating interlayer180. The third conductive layer may be formed using polysilicon, a metalor a metal silicide. The third conductive layer is patterned to form abit line 190 electrically connected to the bit line plug 185 andextending in the second direction.

Alternatively, the bit line plug 185 and the bit line 190 may be formedsimultaneously by depositing and patterning the same conductivematerial.

Accordingly, the flash memory device may be manufactured.

A flash memory device in FIG. 18 is substantially the same as that ofFIG. 17, except that the trenches 105 are formed on the third substrate102 and the gate lines 160 completely enclose a portion of the nanowirestructure 116. Like numerals refer to like elements, and repetitiveexplanations are omitted here. The gate lines 160 include a plurality ofword lines 162, an SSL 164 and a GSL 166.

FIGS. 19 to 22 are perspective views illustrating a method ofmanufacturing a semiconductor device in accordance with other exemplaryembodiments.

Referring to FIG. 19, the nanowire block in FIG. 9 (hereinafter,referred to as a first nanowire block) is formed on the first substrate100 by the above processes illustrated with reference to FIGS. 1 to 8.Like numerals refer to like elements, and repetitive explanations areomitted here.

Referring to FIG. 20, a second nanowire block is disposed on the firstnanowire block. The second nanowire block includes a plurality ofnanowire structures 117 and a second insulation layer pattern 138.

The second nanowire block may be disposed so that each of secondnanowire structures 117 extends in the third direction perpendicular tothe second direction. In exemplary embodiments, the second nanowireblock is disposed so that one surface of each second nanowire structure117 is exposed. In other exemplary embodiments, the second nanowireblock may be disposed so that one surface of each second nanowirestructure 117 makes contact with the first nanowire block. In stillother exemplary embodiments, the second nanowire block may be disposedso that the second insulation layer pattern 138 may encloses allsurfaces of the second nanowire structures 117.

Referring to FIG. 21, the first and second insulation layer patterns 137and 138 are partially removed by an etching process using the secondnanowire structures 117 as an etching mask. Thus, a plurality of secondopenings 146, each of which extends in the third direction and has athird width W3 in the second direction, is formed to partially exposethe first nanowire structures 116. The third width W3 may besubstantially the same as the first distance D1. In exemplaryembodiments, the second openings 146 may not expose end portions of eachfirst nanowire structure 116 using a photoresist pattern (not shown)covering portions of the second insulation layer pattern 138 adjacent tothe outermost second nanowire structure 117 in the etching process.Alternatively, the first and second insulation layer patterns 137 and138 may be removed by a wet etching process.

Referring to FIG. 22, a conductive layer is formed on the firstsubstrate 100 to cover the second openings 146. The conductive layer maybe formed using polysilicon, a metal or a metal suicide. An upperportion of the conductive layer may be planarized to form the gate lines150. Thus, a plurality of gate lines 150, each of which extends in thethird direction and fills the second openings 146, may be formed. Thesecond nanowire structures 117 may be removed.

Referring to FIG. 23, the implantation process illustrated withreference to FIG. 16, and the processes for forming the CSL 175, the bitline plug 185 and the bit line 190 illustrated with reference to FIG.17, are performed to manufacture a flash memory device.

A GAA type flash memory device in which the gate lines completelyenclose portions of the nanowire structures may be manufactured byperforming the process illustrated with reference to FIG. 18.

FIGS. 24, 25, and 27 to 30 are perspective views illustrating a methodof manufacturing a semiconductor device in accordance with still otherexemplary embodiments. Like numerals refer to like elements, andprocesses substantially the same as or similar to those illustrated withprevious drawings are omitted here in order to avoid repetitiveexplanations, however, those skilled in the art can acknowledge that theomitted processes are also within the scope of the present invention.

Referring to FIG. 24, a plurality of catalyst particles 312 is appliedonto a fourth substrate 300.

The fourth substrate 300 may include a semiconductor material such assilicon, germanium, etc.

The catalyst particles 312 may be applied on the fourth substrate 300 ata first distance D1 therebetween in a second direction parallel to thefourth substrate 300, and may form a catalyst particle column. Inexemplary embodiments, a plurality of catalyst particle columns isformed on the fourth substrate 300 in a first direction substantiallyperpendicular to the second direction to form a catalyst particle array.

FIG. 26 is an enlarged perspective view of an area B in FIG. 25.

Referring to FIGS. 25 and 26, nanowires 314 are grown at positions ofthe catalyst particles 312 by a CVD process using a nanowire source gas.The catalyst particles 312 may remain on the nanowires 314. Thenanowires 314 may grow not only in a third direction substantiallyperpendicular to the fourth substrate 300, but also in a randomdirection not perpendicular to the fourth substrate 300. As thenanowires 314 grow, a nanowire column and a nanowire array, whichcorrespond to the catalyst particle column and the catalyst particlearray, respectively, may be formed on the fourth substrate 300.

A tunnel insulation layer 320, a charge storing layer 325 and a blockinglayer 330 enclosing each nanowire 314 and each catalyst particle 312 aresequentially formed. Thus, a plurality of nanowire structures 316, eachof which includes the nanowire 314, the catalyst particle 312, thetunnel insulation layer 320, the charge storing layer 325 and theblocking layer 330, is formed. Additionally, a nanowire structure columnand a nanowire structure array, which correspond to the nanowire columnand the nanowire array, respectively, may be formed.

In FIG. 25, the tunnel insulation layer 320, the charge storing layer325 and the blocking layer 330 are not shown in order to avoidcomplicating the drawings, and in the same manner, other drawings do notshow the above layers.

Referring to FIG. 27, a fifth substrate 400 is moved over the fourthsubstrate 300. The fifth substrate 400 may include an insulatingmaterial. For example, the fifth substrate 400 may include an oxide suchas silicon oxide, a nitride such as silicon nitride, etc. The fifthsubstrate 400 has a first face 402 and a second face 404, and the fifthsubstrate 400 is moved over the fourth substrate 300, with the firstface 402 facing the fourth substrate 300. FIG. 28 illustrates the fifthsubstrate 400 overturned. Hereinafter, the method of manufacturing thesemiconductor device is illustrated with reference to FIG. 27 togetherwith FIG. 28.

In exemplary embodiments, the fifth substrate 400 is moved along thefirst direction (or along a direction opposite to the first direction),and thus the nanowire structures 316 formed on the fourth substrate 300may be attached to the first face 402 of the fifth substrate 400. Eachof the nanowire structures 316 may be disposed on the first face 402 ofthe fifth substrate 400 in the first direction. Thus, a nanowirestructure column including a plurality of nanowire structures 316, eachof which is arranged in the first direction on the first face 402 of thefifth substrate 400, may be formed. Additionally, a nanowire structurearray including a plurality of nanowire structure columns distant fromeach other at a third distance D3 may be formed. An insulating materialhaving sufficient viscosity may be coated on the first face 402 so thatthe nanowire structures 316 may be better attached to the first face 402of the fifth substrate 400. For example, the insulating material mayinclude industrial oil.

As shown in FIG. 28, the fifth substrate 400 is turned over so that thefirst face 402 may face upward, in order to easily form a nanowire blockon the fifth substrate 400.

Referring to FIG. 29, a first insulation layer is formed on the fifthsubstrate 400 to cover the nanowire structures 316, and the firstinsulation layer is patterned to form a first insulation layer pattern337. Thus, the nanowire block including the nanowire structures 316 andthe first insulation layer pattern 337 may be formed. The nanowire blockmay include one nanowire structure column and the insulation layerpattern 337. The first insulation layer may be formed using aninsulating material having an etching selectivity with respect tosilicon oxide.

Both end portions of each nanowire block may be removed, so that thecatalyst particles 312 of the nanowire structures 316 may be removed.Each nanowire block may have a length L in the first direction. Thelength L may correspond to integer times of a string length.

Gate lines 350 enclosing portions of the nanowire structures 316 may beformed by performing processes substantially the same as or similar tothose shown in FIGS. 10 to 15.

Referring to FIG. 30, impurities are implanted into portions of thenanowire structures 316 exposed by the gate lines 350 to define animpurity region and a channel region in each nanowire structure 316. Asa result, a semiconductor device having a Ω-type gate line or a GAA typesemiconductor device may be manufactured. A flash memory deviceincluding nanowire channels may be manufactured by performing theprocesses illustrated with reference to FIGS. 17 and 18.

FIGS. 31 to 36 are perspective views illustrating a method ofmanufacturing a semiconductor device in accordance with still otherexemplary embodiments.

Referring to FIG. 31, a plurality of nanowire structures 316 is formedon the fourth substrate 300 by performing the processes illustrated withreference to FIGS. 24 to 26. Like numerals refer to like elements, andrepetitive explanations are omitted here.

Referring to FIG. 32, the fifth substrate 400 is moved over the fourthsubstrate 300. The fifth substrate 400 has the first and second faces402 and 404, and the fifth substrate 400 is moved over the fourthsubstrate 300 with the first face 402 facing the fourth substrate 300. Asecond insulation layer 410 having an opening 415 partially exposing thefirst face 402 is formed on the first face 402. The nanowire structures316 will be arranged later in the opening on the first face 402. Thesecond insulation layer 410 may be formed using an insulating materialsuch as an oxide or a nitride. FIG. 33 illustrates the fifth substrate400 overturned, and the method of manufacturing the semiconductor deviceis illustrated with reference to FIG. 32 together with FIG. 33.

In exemplary embodiments, the fifth substrate 400 is moved along thefirst direction (or along the direction opposite to the firstdirection), and thus the nanowire structures 316 formed on the fourthsubstrate 300 may be attached to the first space 402 of the fifthsubstrate 400. Each of the nanowire structures 316 may be attached ontoa portion of the first face 402 of the fifth substrate 400 exposed bythe opening 415 in the first direction. An insulating material havingsufficient viscosity may be coated on the first face 402 so that thenanowire structures 316 may be better attached to the first face 402 ofthe fifth substrate 400. Some of the nanowire structures 316 may beattached onto the first insulation layer 410.

As a result, a nanowire structure column including a plurality ofnanowire structures 316, each of which extends in the first direction,may be formed on the portion of the first face 402 exposed by theopening 415, and a nanowire structure array including a plurality ofnanowire structure columns may be formed.

As shown in FIG. 33, the fifth substrate 400 is turned over so that thefirst face 402 may face upward, in order to easily form a nanowire blockon the fifth substrate 400.

Referring to FIG. 34, a third insulation layer pattern 420 is formed tofill the opening 415. In particular, a third insulation layer is formedon the second insulation layer 410 using an insulating material to coverthe opening 415. The third insulation layer may be formed using amaterial different from the second insulation layer 410. An upperportion of the third insulation layer may be planarized by a chemicalmechanical polishing (CMP) process and/or an etch back process to formthe third insulation layer pattern 420.

Referring to FIG. 35, the second insulation layer 410 is removed fromthe fifth substrate 400. Some of the nanowire structures 316 on thesecond insulation layer 410 may be also removed. In exemplaryembodiments, the second insulation layer 410 is removed by a wet etchingprocess. Thus, a nanowire block substantially the same as that of FIG.29 may be formed.

Processes substantially the same as or similar to those illustrated withreference to FIGS. 10 to 15 are performed to form a plurality of gatelines 350 enclosing portions of the nanowire structures 316.

Referring to FIG. 36, impurities are implanted into portions of thenanowire structures 316 exposed by the gate lines 350 like the samemanner shown in FIG. 30, thereby defining an impurity region and achannel region. Thus, a semiconductor device having a Q-type gate lineor a GAA type semiconductor device may be manufactured. A flash memorydevice may be manufactured by further performing the processesillustrated with reference to FIGS. 17 and 18.

According to some exemplary embodiments, a semiconductor deviceincluding a nanowire channel having a minute size may be easilymanufactured. For example, a nanowire channel having a minute size andbeing well-arranged may be formed by a hybrid method including atop-down method and a bottom-up method, so that a highly integratedsemiconductor device may be manufactured.

The foregoing is illustrative of exemplary embodiments and is not to beconstrued as limiting. Although a few exemplary embodiments have beendescribed, those skilled in the art will readily appreciate that manymodifications are possible without materially departing from the novelteachings and advantages of the present invention. Accordingly, all suchmodifications are intended to be included within the scope of thepresent invention as defined in the claims. In the claims, anymeans-plus-function clauses are intended to cover the structuresdescribed herein as performing the recited function and not onlystructural equivalents but also equivalent structures. Therefore, it isto be understood that the foregoing is illustrative of various exemplaryembodiments and that scope of the invention is not to be construed aslimited to the specific exemplary embodiments disclosed. Modificationsto the disclosed exemplary embodiments, as well as other exemplaryembodiments, are intended to be included within the scope of theappended claims.

1. A method of manufacturing a semiconductor device, the methodcomprising: growing a plurality of nanowires on a first substrate in afirst direction perpendicular to the first substrate; forming aninsulation layer covering the nanowires on the first substrate to definea nanowire block including the nanowires and the insulation layer;moving the nanowire block so that each of the nanowires is arranged in asecond direction parallel to the first substrate; partially removing theinsulation layer to partially expose the nanowires; forming a gate linecovering the exposed nanowires; and implanting impurities into portionsof the nanowires adjacent to the gate line.
 2. The method of claim 1,wherein growing the nanowires comprises forming a nanowire column havinga plurality of nanowires arranged at a first distance therebetween in athird direction perpendicular to the first direction.
 3. The method ofclaim 2, wherein forming the nanowire column comprises forming ananowire array having a plurality of nanowire columns arranged at asecond distance therebetween in a fourth direction perpendicular to thethird direction.
 4. The method of claim 3, wherein growing the nanowirescomprises growing the nanowires to a length less than the seconddistance.
 5. The method of claim 3, wherein defining the nanowire blockcomprises removing a portion of the insulation layer having a firstwidth in the third direction to form a plurality of nanowire blocks,each of which includes one nanowire column and an insulation layerpattern.
 6. The method of claim 1, further comprising, after growing thenanowires, sequentially forming a tunnel insulation layer, a chargestoring layer and a blocking layer enclosing the nanowires.
 7. Themethod of claim 1, further comprising, after defining the nanowireblock, removing both end portions of each nanowire.
 8. The method ofclaim 1, wherein partially removing the insulation layer comprisesforming an opening having a second width in a fifth directionperpendicular to the second direction.
 9. The method of claim 1, whereinmoving the nanowire block comprises moving the nanowire block onto asecond substrate, each of the nanowires extending in a sixth directionparallel to the second substrate.
 10. The method of claim 11, furthercomprising forming a common source line (CSL), a bit line plug and a bitline, the CSL and the bit line plug making contact with the nanowires,and the bit line making contact with the bit line plug, wherein eachnanowire, a plurality of gate lines corresponding to each nanowire, theCSL, the bit line plug and the bit line define a string, and whereineach nanowire has a length corresponding to integer times of a length ofthe string.
 11. A method of manufacturing a semiconductor device, themethod comprising: growing a plurality of first nanowires on a firstsubstrate in a first direction perpendicular to the first substrate;forming a first insulation layer covering the first nanowires to definea nanowire block including the first nanowires and the first insulationlayer; moving the first nanowire block so that each of the nanowires isarranged in a second direction parallel to the first substrate;disposing a second nanowire block including second nanowires and asecond insulation layer on the first nanowire block, each of the secondnanowires extending in a third direction parallel to the firstsubstrate; removing the first and second insulation layers using thesecond nanowires as an etching mask; forming a gate line coveringportions of the first nanowires exposed by the second nanowires; andimplanting impurities into portions of the first nanowires adjacent tothe gate line.
 12. The method of claim 11, wherein removing the firstand second insulation layers comprises performing a dry etching processusing the second nanowires as the etching mask.
 13. The method of claim11, further comprising, prior to implanting impurities onto the portionsof the first nanowires, removing the second nanowires.
 14. The method ofclaim 11, wherein moving the first nanowire block comprises moving thefirst nanowire block onto a second substrate, each of the firstnanowires extending in a fourth direction parallel to the secondsubstrate.
 15. A method of manufacturing a semiconductor device, themethod comprising: growing a plurality of nanowires on a firstsubstrate; moving a second substrate over the first substrate to attachthe nanowires on the first substrate onto a face of the secondsubstrate, so that each of the nanowires is arranged in a firstdirection parallel to the second substrate; forming a first insulationlayer covering the nanowires to define a nanowire block including thenanowires and the first insulation layer; partially removing the firstinsulation layer to partially expose the nanowires; forming a gate linecovering the exposed nanowires; and implanting impurities into portionsof the nanowires adjacent to the gate line.
 16. The method of claim 15,wherein a material having a sufficient viscosity is coated on the secondsubstrate so that the nanowires are attached to the face of the secondsubstrate.
 17. The method of claim 15, wherein a second insulation layerhaving an opening is formed on the face of the second substrate, theopening defining an area for forming the nanowire block.
 18. The methodof claim 15, further comprising, after forming the nanowire block,removing the second insulation layer.
 19. The method of claim 15,wherein the nanowires attached into the second substrate are disposed ata given distance therebetween in a second direction perpendicular to thefirst direction to form a nanowire column.
 20. The method of claim 19,wherein a plurality of nanowire columns are disposed at a given distancetherebetween in the first direction to form a nanowire array.